How does the products perform for Polyimide Film in tests and What says from customers?
- kingwin868@126.com
- 13 1 月, 2020
- 10:41 上午
- No Comments
The test results obtained for polyimide film are at an international level and the objective and realistic comments from our customers give us the motivation to improve. All material are made of environment-friendly polyimide resin material and does not contain any harmful substance such as antimony, phosphorus, halogen and lead, fully conforming to the ROHS requirements. The main measurement results for PI film as following:
1. Peeling strength measurement of PI film:
| No. | Test item | Test method | Result |
|---|---|---|---|
| 1 | 90° peel strength | according to JIS C6471-1995 | 1.5N/mm |
As shown in table, the peeling strength of the PI film is 1.5N/mm. By modifying the molecular structure of the polyimide, we have designed the new polyimide film containing ether linkage, hydroxyl groups and amide in order to enhance the peeling strength of the PI film over the copper foil. By applying science of high polymer and redesigning the molecular structure of the polyimide. Daniu has solved the compatible problem of high peel strength and low thermal expansion coefficient when combining the PI film with the copper foil .
2. Surface Resistivity, Dielectric strength and Dielectric Constant, Dielectric Dissipation Measurement of PI film, The test report from the third party.
Report 1:
| Testing sample | surface resistivity (Ω/sq) | dielectric strength(KV/mm) | |
|---|---|---|---|
| Polyimide film | 1 | 5.5×1014 | 203.33 |
| 2 | 5.76×1014 | 201.33 | |
| 3 | 5.57×1014 | 200 | |
| Average value | 5.61×1014 | 201.55 |
Report 2:
| Test sample | Item No. | Dielectric constant | Dielectric Dissipation |
|---|---|---|---|
| Polyimide film | 1 | 3.205448 | 0.0022375 |
| 2 | 3.09815 | 0.0021902 | |
| 3 | 3.2596 | 0.0022095 | |
| 4 | 3.31712 | 0.0023023 | |
| 5 | 3.29015 | 0.0020518 | |
| Average value | 3.2341 | 0.0021983 |
As shown in the tables, our PI film are of high electrical insulation , low dielectric constant and dissipation .
3. Tensile strength and elongation at Break Measurement of PI film
Report1 for Tensile strength
| Test sample | test results (MPa) | |
|---|---|---|
| Polyimide Film | 1 | 270.7 |
| 2 | 260.4 | |
| 3 | 271 | |
| 4 | 272.6 | |
| 5 | 261.2 | |
| Average value | 267.2 |
Report2 for Elongation at Break of PI film
| Test sample | test results (%) | |
|---|---|---|
| Polyimide Film | 1 | 50.1 |
| 2 | 48.7 | |
| 3 | 50.4 | |
| 4 | 49.2 | |
| 5 | 52.1 | |
| Average value | 50.1 |
As the table shown, tensile strength and elongation at break of the PI film are 267.2Mpa and 50.1% respectively. By applying a bi-direction stretching process, the molecules of the polyimide can be oriented along the plane. This makes the material have better plane performance and in the mean time, the mechanical properties of the film also toward isotropic and the tensile strength enhance. As a result, the PI film exhibits good mechanical properties.
4. we compare DaNiu material with material suppliers in Japan and USA as below table, the main indexes of our products have reached the international advanced level and can satisfy the requirements of performance of high-end products .
| Indexes | DaNiu | USA | Japan |
|---|---|---|---|
| PI thickness(um) | 6, 9, 12.5 | 5, 8, 12.5 | 5, 7.5, 12.5 |
| surface resistivity(Ω/sq) | 5.6×1014 | <1.0x1013 | 3.6×1016 |
| volume resistivity (Ω/cm) | 1.1×1017 | >1.0×1016 | 1.5x 1017 |
| 1MHz Dielectric constant | 2.027 | 3.3 | 3.5 |
| Dielectric strength (Kv/mm) | 324 | 320 | 193.3 |
| Thermal expansion coefficient(ppm/°C) | 13.5 | 16 | 20 |
| Elasticity modulus(Gpa) | 5.62 | 4.1 | 3 |
| Tensile strength(Mpa) | 244 | 260 | 350 |
| Elongation(MD and TD) | 84% | 75% | 82% |
| CHE(ppm/% RH) | 2.1 | 9 | 22 |
Client Testimonial
From Japan：
The surface of the polyimide film is smooth, without wrinkles, tearing, particles, bubbles and other extrinsic contamination and defects, The edge of the film appears neat and shows no damage.
From Korea:
Excellent electrical insulation performance , can fully guarantee the integrity of signal transmission, i.e. with no attenuation and distortion, and is suitable for the substrate material used in high-frequency and high-density circuit board manufacturing .
From UK:
The thermal expansion property of DPI films as the encapsulation is good, making the deformation due to temperature and humidity in a very small range. The linear thermal expansion coefficient(CTE) is <21ppm/°C that matches that of the copper foil and chip, sufficient for use as substrates or packaging products exhibiting no warping, delamination, and no cracking. Its hygroscopic expansion coefficient (CHE) is<12ppm/% RH, fully guaranteeing the size stability when used in a wet environment. The pi film shows a high binding strength with a copper foil , with a peeling strength between the film and a low profile copper foil reaching 1.50N/mm, and no delamination. This has met the requirements for packaging the flexible circuit substrate and for chips flexible packaging
From USA,
The dynamic and static bending resistance is good. The MIT bending resistance is tested for 5000times without any problem (change in film resistance is <25%). The IPC flexibility is tested for 15 million times without any problem(change in film resistance is <33%), and at the end of the test, the sample under test can still show normal conduction. These qualities can sufficiently meet the needs in such applications as the laser read-write head, hard disk drive (HDD spindle motor) and the hinge part of a mobile phone, which require a higher static and dynamic bending reliability of the FPC parts .